Digital Microscope System for Tyndall National Institute

Tyndall National Institute at University College Cork seeks tenders for a complete digital microscope system for advanced materials inspection and analysis. The system must provide high-resolution imaging and precise measurement capabilities for electronic and microelectronic structures, including multilayer PCBs, integrated circuits, semiconductor devices, 3D-printed electronics, solder joints, and micro-vias. Required features include 2D and 3D measurement, surface profiling, focus stacking, image stitching, tilted observation modes, and automated setup repetition for consistent image capture and characterization. The solution must be a fully integrated, bench-top system with embedded computing and all necessary software licenses for measurement, analysis, and data export. Bidders should provide hardware and software as a complete, ready-to-deploy package for laboratory use.