Supply of Plasma Etcher and Plasma Deposition Tools for Semiconductor Fabrication - 4 Lots

University College Cork's Tyndall National Institute seeks tenders for the supply, delivery, installation, and commissioning of four specialized plasma processing tools to enhance semiconductor device fabrication capabilities. Lot 1: Advanced plasma etcher for silicon dielectrics (polysilicon, silicon dioxide, silicon nitride) using medium to high-density plasma processes. Lot 2: Advanced plasma etcher for metals and piezoelectrics (aluminum, molybdenum, aluminum scandium nitride) using medium to high-density plasma processes. Lot 3: Advanced plasma etcher with dual capability for both conventional high-rate etching and slow, controllable atomic layer etching for silicon and silicon compounds. Lot 4: Plasma-enhanced chemical vapor deposition (PECVD) system for depositing dielectric and amorphous silicon thin films on semiconductor substrates. These tools are critical for fabricating silicon microelectronics, silicon photonics, silicon MEMS devices, and alternative materials such as germanium and silicon carbide. Equipment must support precision, reliability, and efficiency for processing both 100mm and 200mm diameter wafers. Qualified suppliers with cutting-edge solutions that meet these technical requirements are encouraged to submit proposals.